UCIe.mem

The UCIe Consortium released version 4.0 of its chiplet interconnect specification, extending the architecture from chip-level interfaces to system-level integration of multiple dies in a unified package. It introduces the UCIe.mem on-package memory link with 93.75% data efficiency and roughly 2.5 TB/s/mm beachfront bandwidth density, plus new power-optimized profiles and enhanced bump designs. The update also adds trusted die state reporting, bidirectional integrity-protected management channels, and automotive-grade reliability extensions.