IT之家 · IT业界 · 10/22/2026, 15:09:45
NVIDIA Partners with Six Suppliers to Scale AI Infrastructure Capacity
NVIDIA announced partnerships with six upstream suppliers to significantly expand manufacturing capacity in substrates, advanced packaging, and testing through prepayments and capacity reservation agreements. The initiative aims to triple substrate capacity within three years and drastically increase interposer wafer and CPO optical engine output to meet surging demand for accelerated computing.
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On October 22, it was reported that NVIDIA announced on the 21st (local time) that it is expanding global manufacturing capabilities in collaboration with six supply chain partners to meet the growing market demand for its accelerated computing and full-stack AI factory platforms.
Of these six partnerships, three focus on substrates, while the other three are dedicated to advanced packaging, semiconductor testing, and co-packaged optics (CPO).
NVIDIA plans to increase its required substrate capacity by 2.5 times over the next three years, a move that requires cooperation from upstream manufacturers.
According to an agreement published earlier this year by Japanese company IBIDEN, NVIDIA will support the expansion of production capacity at IBIDEN’s Ono factory in Japan with multi-billion dollar prepayments. This expansion will add twice the current capacity and is expected to come online gradually starting in Q1 2028.
Samsung Electro-Mechanics (SEM) will join NVIDIA’s substrate supply chain and begin shipments immediately. This partnership will support SEM’s factory upgrades and new construction projects in Sejong and Busan. By 2028, NVIDIA is expected to secure a significant portion of SEM’s packaging substrate capacity.
NVIDIA is also supporting Unimicron’s KF substrate expansion through capacity reservation agreements. This project is expected to begin ramping up production in Q2 2027 and reach full capacity in 2028.
In terms of advanced packaging, NVIDIA plans to collaborate with Amkor to expand advanced packaging capacity in South Korea, aiming to increase interposer wafer capacity by more than 300% by the end of 2028. These new capacities, along with Amkor’s new factory construction in South Korea, will support NVIDIA’s manufacturing expansion efforts.
NVIDIA expects its testing demand to double between 2026 and 2027. The company has paid KYEC $1.1 billion (Note: approximately 7.358 billion RMB at current exchange rates) in prepayments to support large-scale mass production at new facilities in Singapore starting February 2027 and in the United States starting April of the same year.
NVIDIA plans to significantly boost CPO optical engine capacity in collaboration with Siliconware Precision Industries (SPIL), targeting a 15-fold increase in capacity by mid-2027 and another doubling by the end of 2028.