Samsung: 2027 HBM Capacity Sold Out, Memory Supply Tight Through 2028
Samsung Electronics confirmed that its High Bandwidth Memory (HBM) capacity for 2027 is fully sold out and predicts tight DRAM supply through 2028. While the broader memory market remains oversupplied, AI-driven demand has caused HBM4 sales to triple quarter-over-quarter, prompting Samsung to lock in most output via long-term agreements.
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IT Home reported on October 29 that Samsung Electronics held its Q3 2026 earnings call earlier this morning (local time). During the call, company executives stated that its HBM production capacity for 2027 has already been sold out at the targeted prices, and overall DRAM memory supply is expected to remain tight through 2028.
In Q3 2026, Samsung Electronics saw single-digit percentage growth in both DRAM and NAND shipment volumes, with Average Selling Prices (ASP) rising by 20% and nearly 10%, respectively. The company projects DRAM shipment volumes to grow by 15–20% in Q4 2026, while NAND shipments are expected to increase by approximately 15%. Despite these gains, the overall memory semiconductor market remains oversupplied, though executives specifically noted receiving significant demand for QLC products.
Samsung’s memory business has signed Long-Term Agreements (LTAs) with 10 customers and is currently negotiating multi-year contracts with another 10. As interest in this contractual model expands into the mobile, automotive, and networking sectors, Samsung is steadily advancing its plan to secure 60–70% of its output through multi-year agreements. Demand for rolling renewals from customers has exceeded expectations, with some clients seeking additional supply during the contract period.
Regarding High Bandwidth Memory (HBM), Samsung Electronics has achieved its goal of aligning its segment-specific market share with its overall DRAM market share ahead of schedule. HBM4 sales grew more than threefold quarter-over-quarter in Q3, accounting for 60% of total HBM revenue.
Additionally, Samsung’s foundry division plans to increase investment in its wafer fabs in South Korea and the United States, aiming to simultaneously build advanced packaging capabilities. The company is evaluating expansion plans, including the construction of additional fabs. The foundry business expects utilization rates for nodes below 8nm to exceed 100%.