NVIDIA's Next-Gen Groq LPU May Shift to 3D Stacked DRAM

1 reports archived1 independent sourcesupdated 10/21/2026, 11:24:30

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Reports indicate NVIDIA's next-generation Groq LPU AI inference chip will likely adopt 3D stacked DRAM via TSV technology, replacing the current large-capacity SRAM design. This shift addresses inherent limitations of SRAM in density and scalability for large models, aligning with industry trends toward vertically integrated memory.

LATEST/Reports indicate NVIDIA's next-generation Groq LPU AI inference chip will likely adopt 3D stacked DRAM via TSV technology, replacing the current large-capacity SRAM design. This shift addresses inherent limitations of SRAM in density and scalability for large models, aligning with industry trends toward vertically integrated memory.

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Total 1 reports · Latest first

IT之家 · 智能时代T2·Oct 21, 11:2468 pts
NVIDIA's Next-Gen Groq LPU May Shift to 3D Stacked DRAM
- NVIDIA's next-gen Groq LPU plans to use 3D stacked DRAM based on TSV technology
- Abandoning large SRAM aims to resolve capacity and process density bottlenecks for large models
- Competitors like Cerebras have also previewed similar 3D vertically integrated DRAM roadmaps
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