Today for AI
HOT RADAR
industryHEAT 11.3°

AI CLUSTERED EVENT · 10/7/2026

Solidigm Prepares for US IPO with Goldman and Morgan Stanley, Valuation Up to $100B

1 reports archived1 independent sourcesupdated 10/7/2026, 10:51:40 PM
Synthesis & Latest Updates
1 Sources Cross-Validated

SK Hynix subsidiary Solidigm has selected Goldman Sachs and Morgan Stanley as lead underwriters for its upcoming US IPO, aiming to raise approximately $10 billion with a potential valuation of up to $100 billion. While the parent company states that plans are still under evaluation, this move signals an accelerated capitalization strategy for the global NAND flash leader.

LATEST/SK Hynix subsidiary Solidigm has selected Goldman Sachs and Morgan Stanley as lead underwriters for its upcoming US IPO, aiming to raise approximately $10 billion with a potential valuation of up to $100 billion. While the parent company states that plans are still under evaluation, this move signals an accelerated capitalization strategy for the global NAND flash leader.

TIMELINECoverage timeline

Total 1 reports · Latest first
  1. IT之家 · IT业界T2·68 pts

    Solidigm Prepares for US IPO with Goldman and Morgan Stanley, Valuation Up to $100B

    Original: SK 海力士旗下 Solidigm 筹备赴美上市：高盛、大摩牵头承销，估值最高或达 1000 亿美元

    • Solidigm has chosen Goldman Sachs and Morgan Stanley as lead underwriters for its IPO, targeting a $10 billion raise.
    • The company's valuation is projected to reach $100 billion, stemming from SK Hynix's acquisition of Intel's NAND business.
    • SK Hynix officially stated it is evaluating various options to enhance competitiveness but has not confirmed specific listing details.