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AI CURATED HOT STORY · 10/23/2026

US Plans $389M Funding for Power Semiconductors in AI Data Centers and Fusion

1 reports archived1 independent sourcesupdated 10/23/2026, 17:46:17
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The US Commerce Department plans to award up to $389 million in R&D funding to four companies under the CHIPS Act, targeting power semiconductors and materials for AI data centers and nuclear fusion. Recipients like Helion and Commonwealth Fusion Systems aim to advance high-voltage GaN devices and ultra-pure quartz. In exchange, the government will acquire minority equity stakes in these firms.

LATEST/The US Commerce Department plans to award up to $389 million in R&D funding to four companies under the CHIPS Act, targeting power semiconductors and materials for AI data centers and nuclear fusion. Recipients like Helion and Commonwealth Fusion Systems aim to advance high-voltage GaN devices and ultra-pure quartz. In exchange, the government will acquire minority equity stakes in these firms.

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Total 1 reports · Latest first
  1. IT之家 · IT业界T2·68 pts
    • The US Commerce Department proposes up to $389M in R&D funding for four firms including Helion and CFS under the CHIPS Act framework.
    • Funding targets high-voltage power semiconductors (e.g., vertical GaN) and ultra-pure quartz, directly supporting AI data center rack power and nuclear fusion systems.
    • Conditions include government acquisition of minority equity stakes, reflecting a new trend of 'state capital intervention' in strategic tech sectors.
US Plans $389M Funding for Power Semiconductors in AI Data Centers and Fusion | Today for AI