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AI CURATED HOT STORY · 11/7/2026

Nvidia Funds ASE Expansion of CoWoS Advanced Packaging Capacity

1 reports archived1 independent sourcesupdated 11/7/2026, 21:50:41
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With TSMC's CoWoS advanced packaging capacity constrained, Nvidia is reportedly providing billions of dollars to ASE's Siliconware Precision to fund new cleanroom expansion and equipment purchases, easing the packaging bottleneck for AI chips. The advanced packaging market is expected to surpass traditional packaging for the first time in 2026, with capex approaching $28 billion.

LATEST/With TSMC's CoWoS advanced packaging capacity constrained, Nvidia is reportedly providing billions of dollars to ASE's Siliconware Precision to fund new cleanroom expansion and equipment purchases, easing the packaging bottleneck for AI chips. The advanced packaging market is expected to surpass traditional packaging for the first time in 2026, with capex approaching $28 billion.

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Total 1 reports · Latest first
  1. IT之家 · IT业界T2·72 pts

    Nvidia Funds ASE Expansion of CoWoS Advanced Packaging Capacity

    • Advanced packaging such as CoWoS has become a key bottleneck for AI processor output, pushing customers to seek second sources as TSMC capacity tightens
    • Nvidia is directly funding upstream packaging expansion with billions of dollars, reflecting urgency in securing capacity
    • The advanced packaging market is projected to surpass traditional packaging in 2026, with capex approaching $28 billion