IT之家 · 智能时代T2·68 pts
- Faraday secures record-breaking Samsung 2nm cloud AI chip design order
- Utilizes vertical stacking of logic SoC and custom DRAM with hybrid bonding
- Supports FP64 computation to accommodate High-Performance Computing (HPC) needs
HOT RADAR
computeHEAT 11.6°
AI CURATED HOT STORY · 10/28/2026
Faraday Secures Samsung 2nm AI Chip Project with 3D Stacked DRAM
1 reports archived1 independent sourcesupdated 10/28/2026, 17:01:15
Synthesis & Latest Updates
1 Sources Cross-ValidatedFaraday Technology announced a major cloud AI chip project from a US client on Samsung's 2nm process, setting company records in design complexity and NRE. The chip features vertically stacked logic SoC and custom DRAM using hybrid bonding, supporting FP64 for HPC tasks to optimize performance and power efficiency.
LATEST/Faraday Technology announced a major cloud AI chip project from a US client on Samsung's 2nm process, setting company records in design complexity and NRE. The chip features vertically stacked logic SoC and custom DRAM using hybrid bonding, supporting FP64 for HPC tasks to optimize performance and power efficiency.
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