IT之家 · IT业界T2·68 pts
- Sixth-gen platform (based on 4F² architecture) passed engineering validation; first DDR5 RDIMM samples expected by year-end.
- Utilizes logic-memory wafer bonding and proprietary VSG transistors to boost density and enable future scaling.
- Fifth-gen platform mass-produced LPDDR5X/LPDDR6, achieving at least 50% higher die yield per wafer than previous gen.