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AI CLUSTERED EVENT · 10/14/2026

IBM and Siemens Partner to Accelerate Nanostack 3D Transistor Mass Production via Advanced EDA Simulation

1 reports archived1 independent sourcesupdated 10/14/2026, 23:12:08
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IBM and Siemens have announced a research partnership combining IBM's semiconductor device innovation with Siemens' expertise in electronic design automation (EDA) and process simulation. The collaboration aims to develop advanced virtual models for the Nanostack architecture to overcome manufacturing hurdles and accelerate mass production of this 3D transistor technology, which integrates nearly 100 billion transistors per square centimeter, with first products expected within five years.

LATEST/IBM and Siemens have announced a research partnership combining IBM's semiconductor device innovation with Siemens' expertise in electronic design automation (EDA) and process simulation. The collaboration aims to develop advanced virtual models for the Nanostack architecture to overcome manufacturing hurdles and accelerate mass production of this 3D transistor technology, which integrates nearly 100 billion transistors per square centimeter, with first products expected within five years.

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Total 1 reports · Latest first
  1. IT之家 · IT业界T2·68 pts
    • The IBM-Siemens partnership focuses on developing advanced virtual models for Nanostack, using EDA simulation to optimize designs and solve manufacturing challenges before fabrication.
    • Nanostack employs vertical stacking with offset alignment, achieving transistor density twice that of IBM's 2nm test chip at the 7-Angstrom node.
    • The architecture offers up to 50% performance gain at equal power or 70% power reduction at equal performance, with significant SRAM scaling benefits for AI high-bandwidth memory.
IBM and Siemens Partner to Accelerate Nanostack 3D Transistor Mass Production via Advanced EDA Simulation | Today for AI