英伟达要求台积电成为第四家先进内存供应商

原标题:Nvidia is trying to create a 4th source of advanced memory.
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英伟达据报已要求台积电成为其第四家先进内存供应商,台积电已开始起草 3D DRAM 制造计划。此举意在打破三星、SK 海力士、美光三家垄断,增加供给并压低议价能力,同时延续此前要求三家厂商采用台积电 3nm 工艺生产定制 HBM 基础裸片的策略。

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Rohan Paul (@rohanpaul_ai) · 2026-11-06 16

Nvidia is trying to create a 4th source of advanced memory.

They have reportedly asked TSMC to become a 4th supplier of advanced memory.

And TSMC reportedly has started drafting plans to make 3D DRAM chips at Nvidia’s request.

means right now Nvidia can buy advanced memory from only 3 companies: Samsung, SK Hynix and Micron.

If TSMC starts making it too, Nvidia gets a 4th place to buy from, which means more supply and less power for the other 3 to raise prices.

The request builds on Nvidia’s reported October requirement that the 3 memory makers all use TSMC’s 3nm process for its custom HBM base dies, so Nvidia can shift order volume between them during shortages.

3D DRAM gives TSMC an opening because no incumbent has turned it into a mature product yet, and TSMC already holds its own vertical DRAM patents.

↳ 引用 @wallstengine (Wall St Engine): TSMC WEIGHS MAKING 3D DRAM AT NVIDIA'S REQUEST

$TSM has reportedly begun drawing up plans to manufacture advanced 3D DRAM chips as AI-driven memory shortages push chip designers to seek additional supply, per The Information.

Unlike conventional DRAM, 3D DRAM stacks memory cells vertically to increase density.

The move could put TSMC in direct competition with Samsung, SK Hynix and Micron.

No production timeline has been set. TSMC is considering building new fabs or converting an existing facility, but says its focus remains on its core logic foundry business.

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