IT之家 · IT业界T2·Infra
78 pts
Infineon has become the first to process 300mm silicon carbide wafers into power semiconductor devices at full-scale production, using existing silicon equipment at its Villach fab in Austria. The company is advancing its 200mm SiC roadmap and has validated cold-split technology on 12-inch SiC at its Dresden site to cut ingot-to-wafer losses.