Samsung Breaks Ground on 46 Trillion Won HBM Packaging Plant
By IT之家Original title: 三星电子韩国温阳产区新 HBM 产线动工，总投资额 46 万亿韩元
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Samsung Electronics has broken ground on a new HBM back-end advanced packaging facility at its Onyang complex in South Korea, comprising five production lines with a total investment of 46 trillion won (about $32 billion), including 40 trillion won for equipment. The plant, slated to start production in 2028 with 31,000 square meters of cleanroom, will substantially expand Samsung's HBM packaging capacity.
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IT之家 11 月 12 日消息，韩国当地时间今日在忠清南道牙山市的三星电子温阳产区新产线动工现场举行忠清圈“超级项目”动工仪式，该国总统李在明出席并致辞。
▲ 三星电子温阳产区
此次动工建设的三星电子温阳产区新产线为 HBM 后端先进封装设施，包括 5 条生产线，项目总投资达 46 万亿韩元（IT之家注：现汇率约合 2,295.4 亿元人民币），包括 6 万亿韩元的厂房投资和 40 万亿韩元的设备投资。
今日启动施工的新工厂将建成一座地上三层的生产设施，总洁净室面积达 3.1 万平方米。项目计划 2028 年投产，三星电子温阳产区的总建筑面积将从此前的 27 万平方米提升至 42 万平方米。