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AI CURATED HOT STORY · 11/12/2026

Samsung Breaks Ground on 46 Trillion Won HBM Packaging Plant

1 reports archived1 independent sourcesupdated 11/12/2026, 13:45:21
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Samsung Electronics has broken ground on a new HBM back-end advanced packaging facility at its Onyang complex in South Korea, comprising five production lines with a total investment of 46 trillion won (about $32 billion), including 40 trillion won for equipment. The plant, slated to start production in 2028 with 31,000 square meters of cleanroom, will substantially expand Samsung's HBM packaging capacity.

LATEST/Samsung Electronics has broken ground on a new HBM back-end advanced packaging facility at its Onyang complex in South Korea, comprising five production lines with a total investment of 46 trillion won (about $32 billion), including 40 trillion won for equipment. The plant, slated to start production in 2028 with 31,000 square meters of cleanroom, will substantially expand Samsung's HBM packaging capacity.

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