GlobalFoundries and TSMC Sign $2B Deal to Build First US Silicon Interposer Facility for CoWoS Packaging

On October 8, GlobalFoundries (GF) announced today that it has reached a manufacturing agreement with TSMC to establish a U.S.-based silicon interposer supply for TSMC’s CoWoS® advanced packaging ecosystem.

Under the agreement, GF will provide manufacturing services and increase capacity at its facility in Malta, New York. This multi-year deal, valued at $2 billion (Note: approximately RMB 13.425 billion at current exchange rates), will expand capacity within the advanced packaging ecosystem and meet the growing demand for artificial intelligence and high-performance computing technologies. The agreement lays the foundation for scaling up capacity as customer demand increases.

GF plans to expand capacity at its Malta facility and establish the first silicon interposer production base in the United States to support advanced packaging technologies, including embedded deep trench capacitor components. The added manufacturing capacity will bring greater scale and flexibility to delivering advanced packaging solutions across multiple product generations.

“Advanced packaging is becoming increasingly critical to achieving the performance, power efficiency, and scale required for next-generation AI systems,” said Ed Kaste, Senior Vice President of CMOS Business at GF. “By leveraging GF’s trusted U.S. manufacturing network to provide manufacturing services, we are creating a secure, scalable source of supply for key advanced packaging components, which will help customers accelerate innovation and strengthen the semiconductor supply chain.”

Expected in the first half of 2028, GF’s Malta facility will begin ramping up volume production. The initial term of the agreement is five years, providing a framework for future capacity expansion.