GlobalFoundries and TSMC Sign $2B Deal to Build First US Silicon Interposer Facility for CoWoS Packaging

1 reports archived1 independent sourcesupdated 10/8/2026, 22:15:09

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GlobalFoundries (GF) has signed a $2 billion multi-year manufacturing agreement with TSMC to establish the first silicon interposer production facility in the United States at its Malta, New York plant. The initiative supports TSMC's CoWoS advanced packaging ecosystem, with mass production expected to begin in H1 2028, aiming to secure critical supply chains for AI and high-performance computing chips.

LATEST/GlobalFoundries (GF) has signed a $2 billion multi-year manufacturing agreement with TSMC to establish the first silicon interposer production facility in the United States at its Malta, New York plant. The initiative supports TSMC's CoWoS advanced packaging ecosystem, with mass production expected to begin in H1 2028, aiming to secure critical supply chains for AI and high-performance computing chips.

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IT之家 · IT业界T2·Oct 8, 22:1568 pts
GlobalFoundries and TSMC Sign $2B Deal to Build First US Silicon Interposer Facility for CoWoS Packaging
Original: 格芯与台积电签署 20 亿美元协议，在美国建立首个硅中介层生产基地
- GlobalFoundries and TSMC sign a $2 billion deal to build the first US-based silicon interposer production facility.
- The new plant is located in Malta, New York, with mass production ramp-up expected in H1 2028.
- The project aims to support the CoWoS advanced packaging ecosystem to meet growing AI and HPC demand.
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