IT之家 · 智能时代T2·72 pts
- SK Hynix is adding HBM4 back-end equipment orders, with some deliveries required by Q1 and installation targeted for H1 next year
- New capacity likely lands at the Cheongju P&T6 packaging and test fab, adding over 20,000 HBM wafers per month at full operation
- The company says DRAM and HBM capacity is effectively sold out through 2029, reflecting persistent AI memory demand