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computeHEAT 11.0°

AI CURATED HOT STORY · 11/15/2026

SK Hynix Accelerates HBM4 Expansion with 20,000 Extra Monthly Wafers

1 reports archived1 independent sourcesupdated 11/15/2026, 16:15:09
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SK Hynix is accelerating procurement and installation of HBM4 production equipment, targeting completion in the first half of next year, with new capacity concentrated at its P&T6 packaging and test fab in Cheongju, Korea. Full operation could add more than 20,000 HBM wafers per month. The company previously said its DRAM and HBM capacity is effectively sold out through 2029, underscoring sustained AI compute demand.

LATEST/SK Hynix is accelerating procurement and installation of HBM4 production equipment, targeting completion in the first half of next year, with new capacity concentrated at its P&T6 packaging and test fab in Cheongju, Korea. Full operation could add more than 20,000 HBM wafers per month. The company previously said its DRAM and HBM capacity is effectively sold out through 2029, underscoring sustained AI compute demand.

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Coverage timeline

Total 1 reports · Latest first
  1. IT之家 · 智能时代T2·72 pts
    • SK Hynix is adding HBM4 back-end equipment orders, with some deliveries required by Q1 and installation targeted for H1 next year
    • New capacity likely lands at the Cheongju P&T6 packaging and test fab, adding over 20,000 HBM wafers per month at full operation
    • The company says DRAM and HBM capacity is effectively sold out through 2029, reflecting persistent AI memory demand