IT之家 · IT业界T2·68 pts
- Tesla invests ~1.1 trillion KRW to help Samsung Electro-Mechanics expand dedicated FC-BGA lines at Sejong
- Substrates are designated for AI chip packaging in Tesla vehicles and Optimus robots
- Facility completion expected by end of 2027, with deliveries starting in 2029
- Nvidia simultaneously drives suppliers to triple IC substrate capacity via massive prepayments